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 Polished Wafer
Prime quality CZ polished wafers from SEH inventory suitable for a variety of device applications in manufacturing and research. These wafers are offered with Etched and WSB (SEH-A standard Wet Sand Blast backside damage) backside wafer conditions.
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Dia |
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5 |
6 |
8 |
12 |
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Product Code |
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5PM0P |
6PM0P |
8PM0P |
12PM0P |
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Type |
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p-boron |
p-boron |
p-boron |
p-boron |
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Orient |
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<100> |
<100> |
<100> |
<100> |
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Res |
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2.0-50.0 |
0.30 - 50.0 |
2.0-50.0 |
2.0-50.0 |
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Surface Metals |
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<= 5 E10 |
<= 5 E10 |
<= 5 E10 |
<= 5 E10 |
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Global Flatness |
TTV |
<5.0 |
<5.0 |
<6.5 |
TBD |
| TIR |
<1.3 |
<3.0 |
<4.0 |
TBD |
| FPD |
<1.0 |
<2.5 |
<3.0 |
TBD |
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Backside |
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Etched or WSB |
Etched or WSB |
Etched or WSB |
Etched or WSB |
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Bow |
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35 |
35 |
20 |
TBD |
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Warp |
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50 |
40 |
55 |
TBD |
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Site Flatness (20X20) max site |
SBIR |
< 1.5 |
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<.70 |
TBD |
| SBID |
** |
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<.5 |
TBD |
| SFLR |
** |
** |
** |
TBD |
| SFLD |
** |
** |
** |
TBD |
| SFQR |
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** |
<.40 |
TBD |
| SFQD |
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<.40 |
<.30 |
TBD |
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LPD USL |
< 0.12 |
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| <0.13 |
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264 |
390 |
TBD |
| <0.16 |
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19 |
90 |
TBD |
| <0.20 |
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12 |
25 |
TBD |
| <0.30 |
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6 |
13 |
TBD |
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Epi Thickness |
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Epi Res |
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Epi Stacking Faults |
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Laser Mark |
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** |
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** Specifications subject to availability.
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