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 Diffused wafers

Silicon wafers with a deep p-n junction created by diffusion techniques are often used for discrete power and MOS power applications, as well as diode based devices. Diffused Wafers are created by diffusing a heavily doped region into a lightly doped wafer. The final thicknesses of both regions can be modified to meet the requirements of the device.

Diffused layers are now used more for very high voltage ( > 800V ) Power MOSFET devices. In this application, the Diffused Wafer may offer both performance and cost of ownership benefits over epi wafers having epi layer thicknesses in excess of 80um.

SEH has more than twenty years of experience manufacturing diffused wafers. The crystal growth and diffusion processes have been optimized to provide the best possible uniformity of both highly and lightly doped regions.

  Epi Layer/ DW Xi Layer Epi SUB/ DW Xj Layer/ Total Thickness
Res (Ωcm) Thickness (μm) Res Thickness (μm) Total Thickness (μm)
900V Epi 33 90 (Sb) 525 615
DW 35 75   210 285
800V Epi 30 80 (Sb) 525 605
DW 30 70   210 280
650V Epi 20 60 (Sb) 525 585
DW 25 55   225 280
600V Epi 22 49 (Sb) 525 574
DW 22 47   200 247
500V Epi 17 41 (Sb) 525 566
DW 17 39   205 244
450V Epi 15 37 (Sb) 525 562
DW 17 32   215 247